Global Standards for the Microelectronics Industry
Document Translation
JEDEC does not currently make any translated JEDEC standards or publications available for free download on our website. JEDEC has translated document descriptions for several of its most popular standards.
The following 7 JEDEC standards have been translated and published in two volumes by CESI:
Chinese
| Volume 1 | JESD79-2 | DDR2 SDRAM Specification |
| JESD79 | DDR SDRAM Specification | |
| Volume 2 | JESD97 | Markings, Symbols and Labels for Identification of Lead (Pb) Free Assemblies, Components and Devices |
| JESD22-B102 | Solderability | |
| J-STD-020 | Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface-Mount Devices | |
| J-STD-033 | Handling, Packing, Shipping And Use Of Moisture/Reflow Sensitive Surface-Mount Devices | |
| JESD22-A113 | Preconditioning of Plastic Surface Mount Devices Prior to Reliability Testing |
如下7项JEDEC标准被翻译成为中文，并出版为两个合集：
| 合集1 | JESD79-2 | DDR2 SDRAM 规范 |
| JESD79 | 双倍数据数列（DDR）SDRAM 规范 | |
| 合集2 | JESD97 | 识别无铅组件、元件和器件的记号、符号和标志 |
| JESD22-B102 | 可焊性 | |
| J-STD-020 | 对于非密封固态表面封装器件的水汽/回流敏感度分类 | |
| J-STD-033 | 湿气/回流敏感表面封装器件的操作、包装、运输和使用 | |
| JESD22-A113 | 非气密表面封装器件可靠性试验前的预处理 |
Japanese
JEITA has some package outlines that are similar to JEP95: JEDEC Registered and Standard Outlines for Solid State and Related Products. For more information visit http://www.jeita.or.jp/english/public_standard/.
