Global Standards for the Microelectronics Industry
JEDEC Committee:
JC-42 Solid State Memories
The products within JC-42's scope include all memory integrated circuits and programmable logic devices, whether static or dynamic, without regard to their fabrication technology or application. Examples include large static and dynamic RAMs, ROMs, EEPROMs, and PLDs. Activities include the development of technical information and standards pertaining to pinouts, operational characteristics including reading and writing algorithms, test parameters, characterization, and registration formats. The committee maintains liaisons with other JEDEC committees and outside organizations to promote wide acceptance of the committee’s actions.
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Recent Documents
SERIAL FLASH DISCOVERABLE PARAMETERS (SFDP) | JESD216F.02 | Jun 2022 |
Definition of the EE1002 and EE1002A Serial Presence Detect (SPD) EEPROMs | SPD4.1.3-01 | May 2022 |
EXPANDED SERIAL PERIPHERAL INTERFACE (xSPI) FOR NONVOLATILE MEMORY DEVICES | JESD251C | May 2022 |
Mobile Platform Memory Module Thermal Sensor Component Specification | MODULE4.7 | May 2022 |
Definition of the TSE2002av Serial Presence Detect (SPD) EEPROM with Temperature Sensor (TS) for Memory Module Applications | SPD4.1.4-01 | May 2022 |
Definitions of the EE1004-v 4 Kbit Serial Presence Detect (SPD) EEPROM and TSE2004av 4 Kbit SPD EEPROM with Temperature Sensor (TS) for Memory Module Applications | SPD4.1.6-01 | May 2022 |
TEMPERATURE RANGE AND MEASUREMENTS FOR COMPONENTS AND MODULES | JESD402-1A | Mar 2022 |
STANDARD MANUFACTURERS IDENTIFICATION CODE | JEP106BE | Jan 2022 |
High Bandwidth Memory DRAM (HBM3) | JESD238 | Jan 2022 |
NAND FLASH INTERFACE INTEROPERABILITY | JESD230E | Oct 2021 |